JPH0139234B2 - - Google Patents
Info
- Publication number
- JPH0139234B2 JPH0139234B2 JP3898380A JP3898380A JPH0139234B2 JP H0139234 B2 JPH0139234 B2 JP H0139234B2 JP 3898380 A JP3898380 A JP 3898380A JP 3898380 A JP3898380 A JP 3898380A JP H0139234 B2 JPH0139234 B2 JP H0139234B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- printed wiring
- wiring board
- prepreg
- foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 30
- 239000002184 metal Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000011888 foil Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 7
- 239000010953 base metal Substances 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 3
- 239000011253 protective coating Substances 0.000 claims 3
- 239000004593 Epoxy Substances 0.000 claims 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004744 fabric Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3898380A JPS56135998A (en) | 1980-03-28 | 1980-03-28 | Method of producing printed circuit board having horizontal circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3898380A JPS56135998A (en) | 1980-03-28 | 1980-03-28 | Method of producing printed circuit board having horizontal circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56135998A JPS56135998A (en) | 1981-10-23 |
| JPH0139234B2 true JPH0139234B2 (en]) | 1989-08-18 |
Family
ID=12540377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3898380A Granted JPS56135998A (en) | 1980-03-28 | 1980-03-28 | Method of producing printed circuit board having horizontal circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56135998A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58103194A (ja) * | 1981-12-15 | 1983-06-20 | 住友電気工業株式会社 | 金属芯印刷配線板 |
| JPS59227190A (ja) * | 1983-06-07 | 1984-12-20 | 日立化成工業株式会社 | 銅張積層板の製造法 |
-
1980
- 1980-03-28 JP JP3898380A patent/JPS56135998A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56135998A (en) | 1981-10-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4853277A (en) | Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby | |
| US4707394A (en) | Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby | |
| JPH07106728A (ja) | リジッドフレックスプリント配線板およびその製造方法 | |
| JPH0139234B2 (en]) | ||
| JP2967539B2 (ja) | 回路基板用の電着接着剤付銅箔並びに電着接着剤を用いた回路基板およびその製法 | |
| JPS62277794A (ja) | 内層回路板の製造方法 | |
| JPH0422039B2 (en]) | ||
| JPH1110791A (ja) | 片面金属張り積層板製造用接合材 | |
| KR910000571B1 (ko) | 도금전사(鍍金轉寫)에 의한 회로기판의 제법 | |
| JP2713763B2 (ja) | 難燃性プリトン回路用基板の製造方法 | |
| JPS637693A (ja) | 抵抗回路付印刷回路板の製造法 | |
| JPS6330797B2 (en]) | ||
| JP2606387B2 (ja) | アディティブ法プリント配線板用積層板の製造方法 | |
| JPH0336315B2 (en]) | ||
| JPS6144064B2 (en]) | ||
| JPS63299197A (ja) | 金属箔張り金属基板の製造方法 | |
| JP2000196236A (ja) | 両面フラッシュプリント配線板およびその製造方法 | |
| JPS6318693A (ja) | 印刷回路板の製造方法 | |
| JPS63245993A (ja) | 印刷配線板の製造方法 | |
| JPS5818799B2 (ja) | タソウプリントハイセンバンノセイゾウホウホウ | |
| JPS5838960B2 (ja) | プリント回路用基板の製造方法 | |
| JPH06262723A (ja) | 銅張積層板の製造方法 | |
| JPH02143853A (ja) | 金属ベース積層板 | |
| JPS59129491A (ja) | プリント配線板用積層板の製造方法 | |
| JPS6053707B2 (ja) | 化学メツキ用積層板の製造方法 |